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SEC Comment Letter 0000000000-24-002074 to T Stamp Inc (IDAI) (CIK 0001718939) (IDAI)

T Stamp Inc (IDAI) (CIK 0001718939)
Date: Feb. 23, 2024 · CIK: 0001718939 · Accession: 0000000000-24-002074

AI Filing Summary & Sentiment

File numbers found in text: 333-277151

Date
February 23, 2024
Author
Office of Technology
Form
UPLOAD
Company
T Stamp Inc (IDAI) (CIK 0001718939)

Letter

United States securities and exchange commission logo February 23, 2024 Alex Valdes Chief Financial Officer T Stamp, Inc. 3017 Bolling Way NE, Floors 1 and 2 Atlanta, GA 30305 Re:T Stamp, Inc. Registration Statement on Form S-3 Filed February 16, 2024 File No. 333-277151 Dear Alex Valdes: This is to advise you that we have not reviewed and will not review your registration statement. Please refer to Rules 460 and 461 regarding requests for acceleration. We remind you that the company and its management are responsible for the accuracy and adequacy of their disclosures, notwithstanding any review, comments, action or absence of action by the staff. Please contact Uwem Bassey at 202-551-3433 or Jan Woo at 202-551-3453 with any questions. Sincerely, Division of Corporation Finance Office of Technology cc: Andrew Stephenson

Show Raw Text
United States securities and exchange commission logo
February 23, 2024
Alex Valdes
Chief Financial Officer
T Stamp, Inc.
3017 Bolling Way NE, Floors 1 and 2
Atlanta, GA 30305
Re:T Stamp, Inc.
Registration Statement on Form S-3
Filed February 16, 2024
File No. 333-277151
Dear Alex Valdes:
            This is to advise you that we have not reviewed and will not review your registration
statement.
            Please refer to Rules 460 and 461 regarding requests for acceleration. We remind you
that the company and its management are responsible for the accuracy and adequacy of their
disclosures, notwithstanding any review, comments, action or absence of action by the staff.
            Please contact Uwem Bassey at 202-551-3433 or Jan Woo at 202-551-3453 with any
questions.
Sincerely,
Division of Corporation Finance
Office of Technology
cc:       Andrew Stephenson